Biomedical Imaging GroupSTI
English only   BIG > Publications > MA-TIRF Reconstruction

 Home Page
 News & Events
 Tutorials and Reviews
 Download Algorithms

 All BibTeX References

Improving 3D MA-TIRF Reconstruction with Deconvolution and Background Estimation

E. Soubies, L. Blanc-Féraud, S. Schaub, E. Van Obberghen-Schilling

Proceedings of the Sixteenth IEEE International Symposium on Biomedical Imaging (ISBI'19), Venice, Italian Republic, April 8-11, 2019, in press.

Please do not bookmark the "In Press" papers as content and presentation may differ from the published version.

Total internal reflection fluorescence microscopy (TIRF) produces 2D images of the fluorescent activity integrated over a very thin layer adjacent to the glass coverslip. By varying the illumination angle (multi-angle TIRF), a stack of 2D images is acquired from which it is possible to estimate the axial position of the observed biological structures. Due to its unique optical sectioning capability, this technique is ideal to observe and study biological processes at the vicinity of the cell membrane. In this paper, we propose an efficient reconstruction algorithm for multi-angle TIRF microscopy which accounts for both the PSF of the acquisition system (diffraction) and the background signal (e.g., autofluorescence). It jointly performs volume reconstruction, deconvolution, and background estimation. This algorithm, based on the simultaneous-direction method of multipliers (SDMM), relies on a suitable splitting of the optimization problem which allows to obtain closed form solutions at each step of the algorithm. Finally, numerical experiments reveal the importance of considering the background signal into the reconstruction process, which reinforces the relevance of the proposed approach.

© 2019 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from IEEE.
This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.